Hirejobs Canada
Register
Auckland Jobs
Canterbury Jobs
Northland Jobs
Otago Jobs
Southland Jobs
Tasman Jobs
Wellington Jobs
West Coast Jobs
Oil & Gas Jobs
Banking Jobs
Construction Jobs
Top Management Jobs
IT - Software Jobs
Medical Healthcare Jobs
Purchase / Logistics Jobs
Sales
Ajax Jobs
Designing Jobs
ASP .NET Jobs
Java Jobs
MySQL Jobs
Sap hr Jobs
Software Testing Jobs
Html Jobs
IT Jobs
Logistics Jobs
Customer Service Jobs
Airport Jobs
Banking Jobs
Driver Jobs
Part Time Jobs
Civil Engineering Jobs
Accountant Jobs
Safety Officer Jobs
Nursing Jobs
Civil Engineering Jobs
Hospitality Jobs
Part Time Jobs
Security Jobs
Finance Jobs
Marketing Jobs
Shipping Jobs
Real Estate Jobs
Telecom Jobs

RF Packaging Program Manager - Jobs in Chandler, QC

NXP Semiconductors
Job LocationChandler, QC
EducationNot Mentioned
SalaryNot Disclosed
IndustryNot Mentioned
Functional AreaNot Mentioned
Job TypeFull Time

Job Description

Primary Responsibilities:

  • Represents Package Innovation (PI) to the Radio Power Business Line (BL). Is the go- to person for package related topics and works closely together with expert disciplines in PI to provide best in class solutions.
  • R esponsible for creating a package roadmap based of BL product roadmap and keep a regular update
  • Defines with BL the annual operating plan based on project list and financial boundary conditions
  • Selects optimal package solution for New Product Introduction (NPI) and project initiation for the development of the package or package technology
  • Is active participant in site selection process by driving OSAT / Internal assembly capability assessment and quotations
  • Reports to BL stakeholders on high level progress of the program
  • Manages alignment between ways of working and disconnects
  • Serves as first escalation path in case project deliverables are at risk ( schedule , quality or cost ) and drives a path forward.
  • Involve international traveling to visit assembly locations / technology partners
Qualifications:
  • A strong technical background and experience in package technology:M.S. or PhD in Physics , Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering5-10 years of experience in Semiconductor Packaging development role, preferably in power modules
  • Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
  • Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
  • Has an entrepreneurial mindset and creative in finding solutions to bring troubled projects back on track to meet business objectives
  • Is supportive to BL yet decisive when it comes to quality, budget and program priorities
  • Is a good communicator, able to build relationships always on the look out for Win-Win opportunites
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.Quick Apply
  • Terms & Conditions
  • New Privacy
  • Privacy Center
  • Accessibility
For Job Seekers
  • Browse Jobs
  • Advanced Job Search
  • Emplois Quebec
For Employers
  • Post a Job
  • SimplyHired OnDemand
Stay Connected

APPLY NOW

RF Packaging Program Manager Related Jobs

© 2021 HireJobsCanada All Rights Reserved